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HGR Industrial Surplus has a Logitech Scotland wax-layer coating system for sale at its Euclid, Ohio, showroom. This wax coating system has a model number WCS10 and weighs 440 pounds. It comes with a digital readout, 12-inch diameter by 15-inch high chamber and manual for your inspection needs. The manual covers vacuum deposition of wax for precision bonding using the WCS10 was coater. Production of thin and ultra-thin wafers of material, such as semiconductors and piezoelectric crystals requires accurate mounting of the thick wafter material onto a flat supporting substrate for recise control of geometry and protection from breakage during the thinning process. The nature of the specimen-substrate bond is critical. The bonding medium may be chosen from a variety of materials; in some cases, a permanent metallic or epoxy bond might be appropriate while for others it is necessary to use a soluble material so that the finished wafer may be released from the substrate for further processing. The manual is concerned with the initial stage of a wax bonding process for production of demountable thin wafers. The Logitech WCS wax coating system has been developed for the purpose to provide a high yield of precise geometry thin wafers down to 10 microns and ultimately thinner.